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strip-based process. The resulting transistor shows
extremely high packing density for low on-resis-
tance, rugged avalanche characteristics and less
critical alignment steps therefore a remarkable man-
ufacturing reproducibility.
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
s
BATTERY SAFETY UNIT IN NOMADIC
EQUIPMENT
s
DC-DC CONVERTERS
s
POWER MANAGEMENT IN PORTABLE/
DESKTOP PC
S
ABSOLUTE MAXIMUM RATINGS
Symbol
V
DS
V
DGR
V
GS
I
D
Parameter
Drain-source Voltage (V
GS
= 0)
Drain-gate Voltage (R
GS
= 20 k鈩?
Gate- source Voltage
Drain Current (continuos) at T
C
= 25擄C
Single Operation
Drain Current (continuos) at T
C
= 100擄C
Single Operation
Drain Current (pulsed)
Total Dissipation at T
C
= 25擄C Dual Operation
Total Dissipation at T
C
= 25擄C Single Operation
Value
30
30
鹵12
6
3.8
24
2
1.6
Unit
V
V
V
A
A
A
W
W
I
DM
(
l
)
P
TOT
(
q
) Pulse width limited by safe operating area
July 2002
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