STMicroelectronics unique 鈥漇ingle Feature Size鈩?/div>
鈥?strip-based process. The resulting transistor
shows extremely high packing density for low on-
resistance, rugged avalanche characteristics and
less critical alignment steps therefore a remarka-
ble manufacturing reproducibility.
APPLICATIONS
s
BATTERY MANAGMENT IN NOMADIC
EQUIPMENT
s
POWER MANAGMENT IN CELLULAR
PHONES
SO-8
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symb ol
V
DS
V
DGR
V
GS
I
D
Parameter
Drain-source Voltage (V
GS
= 0)
Drain- gate Voltage (R
GS
= 20 k鈩?
G ate-source Voltage
Drain Current (continuous) at Tc = 25
o
C
Single O peration
Drain Current (continuous) at T
c
= 100
o
C
Single O peration
Drain Current (pulsed)
T otal Dissipation at T
c
= 25
o
C
Value
30
30
鹵
20
5
3
20
2.5
Un it
V
V
V
A
A
A
W
I
DM
(
鈥?/div>
)
P
tot
(
鈥?/div>
) Pulse width limited by safe operating area
Note: For the P-CHANNEL MOSFET actual polarity of voltages and current has to be reversed
November 1999
1/6
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