(on) = 0.088鈩?/div>
IMPROVED DIE-TO-FOOTPRINT RATIO
VERY LOW PROFILE PACKAGE (1mm MAX)
VERY LOW THERMAL RESISTANCE
LOW GATE RESISTANCE
LOW INPUT CAPACITANCE
HIGH dv/dt and AVALANCHE CAPABILITIES
PowerFlat (6x5)
(Chip Scale Package)
DESCRIPTION
This 200V MOSFET with a new advanced layout
brings all unique advantages of MDmesh technol-
ogy to lower voltages. The device exhibits world-
wide lowest gate charge for any given on-
resistance.Its use is therefore ideal as primary
switch in isolated DC-DC converters for Telecom
and Computer applications.Used in combination
with secondary-side low-voltage STripFET
TM
prod-
ucts, it contributes to reducing losses and boosting
efficiency.The new PowerFLAT鈩?package allows
a significant reduction in board space without com-
promising performance.
Figure 2: Internal Schematic Diagram
APPLICATIONS
The MDmesh
TM
family is very suitable for increas-
ing power density allowing system miniaturization
and higher efficiencies
Table 2: Order Codes
SALES TYPE
STL20NM20N
MARKING
L20NM20N
PACKAGE
PowerFLAT鈩?6x5)
PACKAGING
TAPE & REEL
Rev. 3
June 2005
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