SMARTCARD MCU
Ordering Information
For Package And Delivery
DATA BRIEFING
INTRODUCTION
The manufacturing process of Smartcards in-
volves various components and technologies in
order to issue a finished product:
鈥?micromodules,
鈥?flat packages,
鈥?wafers.
MICROMODULES
Dedicated package for Smartcard products, the
micromodule type depends on the size of the
product and on the application.
Table 1 lists all available micromodules.
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FLAT PACKAGES
For applications which require surface mount tech-
nology, suitable for PC cards, or other security
modules, STMicroelectronics offers flat packages
listed In Table 2.
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WAFERS
For issuer production need, ST offers sawn and
unsawn wafers deliveries, listed in Table 3.
Figure 1. Delivery form
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Table 1. Micromodules in super 35 standard
tape
Type
D1, D2
D15
D3, D4
D5
D68
D7
C7
D8
Description
8 contacts for memory cards
6 contacts for memory cards
8 contacts with ring MCU cards
8 contacts for dual contact contactless
MCU cards
8 contacts for MCU cards
6 contacts for dual contact contactless
MCU cards
Full contactless for MCU cards
8 contacts for MCU cards
Table 2. Flat Packages
Type
O20
Description
SO20 for MCU products
TQFP44 for MCU products
SO20 on tape and reel for MCU products
SO20
QF4
R20
Table 3. Wafers
261a.ai
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Micromodule
W00
W20
Notch
W40
S2x
R4x
S4x
8鈥?Wafer
T4x
Unsawn wafers, 750 碌m thickness
Unsawn wafers, 275 碌m thickness
Unsawn wafers, 180 碌m thickness
280 碌m sawn wafers on UV tape
180 碌m sawn wafers on insolated UV tape
180 碌m sawn wafers on UV tape
180 碌m sawn wafers on blue tape
September 2001
This is Brief Data from STMicroelectronics. Details are subject to change without notice. For complete data, please contact
your nearest Sales Office or SmartCard Products Divison, Rousset, France. Fax: (+33) 4 42 68 87 29.
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Type
Description
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