The PowerMESH鈩?/div>
II
is the evolution of the first
generation of MESH OVERLAY鈩?. The layout
refinements introduced greatly improve the
Ron*area figure of merit while keeping the device
at the leading edge for what concerns switching
speed, gate charge and ruggedness.
APPLICATIONS
錕?frac12;
HIGH CURRENT, HIGH SPEED SWITCHING
錕?frac12;
SWITCH MODE POWER SUPPLIES (SMPS)
錕?frac12;
DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES AND MOTOR DRIVE
I
2
PAK
TO-262
(Suffix 鈥?1鈥?
D
2
PAK
TO-263
(Suffix 鈥漈4鈥?
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symb ol
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
(鈥?
P
tot
dv/dt(
1
)
T
s tg
T
j
Parameter
Drain-source Voltage (V
GS
= 0)
Drain- gate Voltage (R
GS
= 20 k鈩?
G ate-source Voltage
Drain Current (continuous) at T
c
= 25
o
C
Drain Current (continuous) at T
c
= 100 C
Drain Current (pulsed)
T otal Dissipation at T
c
= 25 C
Derating Factor
Peak Diode Recovery voltage slope
Storage Temperature
Max. O perating Junction Temperature
o
o
Value
600
600
鹵
30
3
1.9
12
80
0.64
4
-65 to 150
150
(
1
) I
SD
鈮?A,
di/dt
鈮?/div>
100 A/碌s, V
DD
鈮?/div>
V
(BR)DSS
, Tj
鈮?/div>
T
JMAX
Unit
V
V
V
A
A
A
W
W/
o
C
V/ns
o
o
C
C
(鈥? Pulse width limited by safe operating area
February 2000
1/9
next