鈥?/div>
Small package
Low on-resistance
: R
on
=
8
惟
(max) (@V
GS
= 鈭?
V)
: R
on
=
12
惟
(max) (@V
GS
= 鈭?.5
V)
: R
on
=
45
惟
(max) (@V
GS
= 鈭?.5
V)
Unit: mm
Absolute Maximum Ratings
(Ta = 25擄C) (Q1, Q2 Common)
Characteristics
Drain-Source voltage
Gate-Source voltage
Drain current
DC
Pulse
Symbol
V
DS
V
GSS
I
D
I
DP
P
D
(Note 1)
T
ch
T
stg
Rating
鈭?0
鹵10
鈭?00
鈭?00
150
150
鈭?5~150
Unit
V
V
mA
mW
擄C
擄C
Drain power dissipation (Ta
=
25擄C)
Channel temperature
Storage temperature range
Note:
Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the
absolute maximum ratings.
Please design the appropriate reliability upon reviewing the
Toshiba Semiconductor Reliability Handbook (鈥淗andling
Precautions鈥?鈥淒erating Concept and Methods鈥? and individual
reliability data (i.e. reliability test report and estimated failure
rate, etc).
1: Source1
2: Gate1
3: Drain2
4: Source2
5: Gate2
6: Drain1
JEDEC
JEITA
TOSHIBA
鈥?/div>
鈥?/div>
2-2N1D
Note 1: Total rating, mounted on FR4 board
2
(25.4 mm
脳
25.4 mm
脳
1.6 t, Cu Pad: 0.135 mm
脳
6)
0.3 mm
Marking
6
5
4
0.45 mm
Equivalent Circuit
(top view)
6
5
4
DT
1
2
3
1
Q1
Q2
2
3
Handling Precaution
When handling individual devices (which are not yet mounted on a circuit board), ensure that the environment is
protected against static electricity. Operators should wear anti-static clothing, and containers and other objects
that come into direct contact with devices should be made of anti-static materials.
1
2007-11-01
1
2
3
4
5
