鈥?/div>
2-2N1D
(Ta = 25擄C)
Absolute Maximum Ratings
(Q1, Q2 Common)
Characteristics
Drain power dissipation (Ta
=
25擄C)
Channel temperature
Storage temperature range
Symbol
P
D
(Note 1)
T
ch
T
stg
Rating
150
150
鈭?5~150
Unit
mW
擄C
擄C
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(鈥淗andling Precautions鈥?鈥淒erating Concept and Methods鈥? and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Total rating, mounted on FR4 board
2
(25.4 mm
脳
25.4 mm
脳
1.6 t, Cu Pad: 0.135 mm
脳
6)
0.45 mm
0.3 mm
1
2007-11-01