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SSM6L13TU Datasheet

  • SSM6L13TU

  • Power Management Switch Applications

  • 8頁

  • TOSHIBA

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SSM6L13TU
TOSHIBA Field-Effect Transistor Silicon P / N Channel MOS Type
SSM6L13TU
Power Management Switch Applications
High-Speed Switching Applications
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
1.8 V drive
P鈥揷h , N鈥揷h 2鈥搃n鈥?
Low ON鈥搑esistance: Pch
: Nch
2.1鹵0.1
1.7鹵0.1
0.65 0.65
+0.1
0.3-0.05
Unit: mm
2.0鹵0.1
1.3鹵0.1
R
on
= 460 m鈩?(max) (@V
GS
=
鈭?.8
V)
R
on
= 306 m鈩?(max) (@V
GS
=
鈭?.5
V)
R
on
= 235 m鈩?(max) (@V
GS
= 1.8 V)
R
on
= 178 m鈩?(max) (@V
GS
= 2.5 V)
1
2
3
6
5
4
Q1 Absolute Maximum Ratings
(Ta = 25 擄C)
Drain-source voltage
Gate-source voltage
Drain current
DC
Pulse
V
DS
V
GSS
I
D
I
DP
20
鹵
12
0.8
1.6
V
V
A
0.7鹵0.05
Characteristic
Symbol
Rating
Unit
Q2 Absolute Maximum Ratings
(Ta = 25 擄C)
Characteristic
Drain-source voltage
Gate-source voltage
Drain current
DC
Pulse
Symbol
V
DS
V
GSS
I
D
I
DP
Rating
鈭?0
鹵
8
鈭?.8
鈭?.6
Unit
V
V
A
1.Source1
2.Gate1
UF6 3.Drain2
JEDEC
JEITA
TOSHIBA
Weight: 7 mg (typ.)
4.Source2
5.Gate2
6.Drain1
鈥?/div>
鈥?/div>
2-2T1B
(Ta = 25 擄C)
Absolute Maximum Ratings
(Q1 , Q2 Common)
Characteristic
Drain power dissipation
Channel temperature
Storage temperature range
Symbol
P
D (Note 1)
T
ch
T
stg
Rating
500
150
鈭?5
to 150
Unit
mW
擄C
擄C
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(鈥淗andling Precautions鈥?鈥淒erating Concept and Methods鈥? and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Mounted on an FR4 board (total dissipation)
2
(25.4 mm
脳
25.4 mm
脳
1.6 mm, Cu Pad: 645 mm )
Marking
6
5
4
Equivalent Circuit
(top view)
6
5
4
KV
1
2
3
1
Q1
Q2
2
3
Handling Precaution
When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is
protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that
come into direct contact with devices should be made of antistatic materials.
1
2007-11-01
+0.06
0.16-0.05

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