鈥?/div>
Low profile Surface Mount package
Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
Built-in strain relief
Low power loss, high efficiency
For use in low voltage high frequency inverters, free wheeling, and
polarity protection applications
Guarding for overvoltage protection
High Temp Soldering: 250擄C for 10 Seconds At Terminals
鈥?/div>
鈥?/div>
鈥?/div>
Maximum Ratings
JEDEC DO-214AB molded plastic body
Solder plated, solderable per MILSTD750, Method 2026
Color band denotes cathode end
MCC
Part
Number
SS32
SS33
SS34
SS35
SS36
Device
Marking
S2
S3
S4
S5
S6
Maximum
Repetitive Peak
Reverse
Voltage
20V
30V
40V
50V
60V
I
F(AV)
I
FSM
Maximum
RMS
Voltage
14V
21V
28V
35V
42V
3.0A
100A
Maximum
DC
Blocking
Voltage
20V
30V
40V
50V
60V
T
J
= 25擄C
8.3ms, half
sine
I
FM
= 3.0A
(1)
T
J
= 25擄C
T
J
= 25擄C
T
J
= 100擄C
(1)
DIM
A
B
C
D
E
F
G
H
J
Cathode Band
J
A
E
C
D
B
G
DIMENSIONS
INCHES
MIN
.075
.115
.004
---
.030
.305
.260
.220
MAX
.095
.121
.008
.02
.060
.320
.280
.245
MM
MIN
1.90
2.92
.10
---
.76
7.75
6.60
5.59
MAX
2.41
3.07
.20
.51
1.52
8.13
7.11
6.22
NOTE
Electrical Characteristics @ 25擄C Unless Otherwise Specified
Maximum Average Forward
Current
Peak Forward Surge
Current
Maximum Instantaneous
Forward Voltage
SS32-34
SS35-36
Maximum DC Reverse
Current At Rated DC
Blocking Voltage
SS32-34
SS35-36
Typical Thermal
(2)
resistance
Operating junction
temperature range
Storage temperature range
V
F
.50V
.75V
.5mA
20mA
10mA
55
O
C/W
O
17 C/W
-55 to+150
O
C
-55 to+150 C
O
SUGGESTED SOLDER
PAD LAYOUT
0.185鈥?/div>
I
R
R
JA
R
JL
T
J
T
STG
0.125鈥?/div>
0.075鈥?/div>
(1) Pulse test: Pulse width 300 usec, Duty cycle 1%
(2)
P.C.B. mounted 0.55x0.55鈥?14x14mm) copper pad areas
www.mccsemi.com
SS35 產(chǎn)品屬性
1
分離式半導(dǎo)體產(chǎn)品
單二極管/整流器
-
肖特基
50V
3A
750mV @ 3A
快速恢復(fù) = 200mA（Io）
-
500µA @ 50V
-
表面貼裝
DO-214AB，SMC
DO-214AB，（SMC）
Digi-Reel®
SS35FSDKR
SS35相關(guān)型號PDF文件下載
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版本
描述
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