鈥?/div>
Economical surface mount design in both J-bend or
Gull-wing terminations
Available in both Unidirectional and Bidirectional
construction with a C or CA suffix
Suppresses transients up to 1500 watts @ 10/1000 碌s
Qualified to UL497B
Optional 100%
screening for avionics grade
is
available by adding MA prefix to part number for added
100% temperature cycle -55
o
C to +125
o
C (10X) as well
as surge (3X) and 24 hours HTRB with post test V
Z
&
I
R
(in the operating direction for unidirectional or both
directions for bidirectional)
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers.
Axial-lead equivalent packages for thru-hole mounting
available as 1.5KE6.8 to 1.5KE200CA or 1N6267 thru
1N6303A and 1N5908 (consult factory for other
surface mount options)
Moisture classification is Level 1 with no dry pack
required per IPC/JEDEC J-STD-020B
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
APPLICATIONS / BENEFITS
Selections for 5.0 to 170 volts standoff voltages (V
WM
)
Protection from switching transients and induced RF
Protection from ESD, and EFT per IEC 61000-4-2 and
IEC 61000-4-4
Secondary lightning protection per IEC61000-4-5 with
42 Ohms source impedance:
Class 1: SMC 5.0 to SMC 170A or CA
Class 2: SMC 5.0 to SMC 150A or CA
Class 3: SMC 5.0 to SMC 75A or CA
Class 4: SMC 5.0 to SMC 36A or CA
Secondary lightning protection per IEC61000-4-5 with
12 Ohms source impedance:
Class 1 : SMC 5.0 to SMC 90A or CA
Class 2: SMC 5.0 to SMC 45A or CA
Class 3: SMC 5.0 to SMC 24A or CA
Class 4: SMC 5.0 to SMC 11A or CA
Secondary lightning protection per IEC61000-4-5 with
2 Ohms source impedance:
Class 2: SMC 5.0 to SMC 22A or CA
Class 3: SMC 5.0 to SMC 10A or CA
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
MAXIMUM RATINGS
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
Peak Pulse Power dissipation at 25
潞
C: 1500 watts at
10/1000
碌s
(also see Fig 1,2, and 3)
Impulse repetition rate (duty factor): 0.01%
t
clamping
(0 volts to V
(BR)
min.): < 100 ps theoretical for
unidirectional and < 5 ns for bidirectional
Operating and Storage temperature: -65
潞
C to +150
潞
C
Thermal resistance: 20
潞
C/W junction to lead, or 80
潞
C/W
junction to ambient when mounted on FR4 PC board
(1oz Cu) with recommended footprint (see last page)
Steady-State Power dissipation: 6 watts at T
L
= 30
o
C,
or 1.56 watts at T
A
= 25
潞
C when mounted on FR4 PC
board with recommended footprint
Forward Surge: 200 Amps peak impulse of 8.3 ms
half-sine wave at 25潞C (unidirectional only)
Solder temperatures: 260
潞
C for 10 s (maximum)
鈥?/div>
鈥?/div>
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
TERMINALS: Gull-wing or C-bend (modified J-bend)
leads, tin-lead plated solderable to MIL-STD-750,
method 2026
POLARITY: Cathode indicated by band. No marking
on bi-directional devices
MARKING: Part number without SM prefix (e.g.
C5.0, C5.0A, C5.0CA, C36, C36A, C36CA, etc.)
TAPE & REEL option: Standard per EIA-481-2 with
16 mm tape, 750 per 7 inch reel or 2500 per 13 inch
reel (add 鈥淭R鈥?suffix to part number)
WEIGHT:
0.25 grams
SMC 5.0 鈥?170V
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
Copyright
錚?/div>
2005
2-23-05 REV C
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
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