鈮?/div>
25擄C
Total Power Dissipation on FR-5 Board
(Note 3) @ T
A
= 25擄C
Thermal Resistance from Junction鈭抰o鈭扐mbi-
ent
Total Power Dissipation on Alumina Sub-
strate (Note 4) @ T
A
= 25擄C
Derate above 25擄C
Thermal Resistance from Junction鈭抰o鈭扐mbi-
ent
Junction and Storage Temperature Range
Lead Solder Temperature 鈭?Maximum (10
Second Duration)
Symbol
P
pk
P
pk
擄P
D
擄
R
qJA
擄P
D
擄
Value
24
150
擄225
1.8
556
擄300
2.4
417
擄鈭?/div>
55 to
+150擄
260
Unit
W
W
擄mW擄
mW/擄C
擄C/W
擄mW
mW/擄C
xxx
M
= Device Code
= Date Code
MARKING DIAGRAM
xxx
ORDERING INFORMATION
R
qJA
T
J
, T
stg
T
L
擄C/W
擄C
See detailed ordering and shipping information in the table on
page 5 of this data sheet.
DEVICE MARKING INFORMATION
擄C
See specific marking information in the device marking table
on page 5 of this data sheet.
Preferred
devices are recommended choices for future use
and best overall value.
漏
Semiconductor Components Industries, LLC, 2004
1
April, 2004 鈭?Rev. 4
Publication Order Number:
MMQA/D
M
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