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High temperature soldering in accordance with
CECC 802 / Reflow guaranteed
0.320 (8.13)
0.360 (9.14)
1
K
2
0.575 (14.60)
0.625 (15.88)
SEATING
PLATE
-T-
0.090 (2.29)
0.110 (2.79)
0.018 (0.46)
0.025 (0.64)
0.027 (0.686)
0.037 (0.940)
0.080 (2.03)
0.110 (2.79)
0.095 (2.41)
0.100 (2.54)
MECHANICAL DATA
PIN 1
K - HEATSINK
PIN 2
Dimensions in inches and (millimeters)
Case:
JEDEC TO-263AB molded plastic body
Terminals:
Leads solderable per MIL-STD-750,
Method 2026
Polarity:
As marked
Weight:
0.08 ounce, 2.24 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
SBLB25L20CT SBLB25L25CT SBLB25L30CT
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at T
C
=95擄C
Peak forward surge current, 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
Maximum instantaneous forward voltage per leg at 12.5A
(NOTE 1)
T
C
=125擄C
T
C
=25擄C
Maximum instantaneous reverse current at
rated DC blocking voltage per leg
(NOTE 1)
Typical thermal resistance per leg
(NOTE 2)
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
20
14
20
25
17
25
25.0
180.0
30
21
30
Volts
Volts
Volts
Amps
Amps
V
F
0.39
0.49
1.0
50.0
100.0
1.5
-40 to +125
Volts
T
C
=25擄C
T
C
=100擄C
T
C
=125擄C
I
R
R
螛JC
T
J
, T
STG
mA
擄C/W
擄C
Operating junction and storage temperature range
NOTES:
(1) Pulse test: 300碌s pulse width, 1% duty cycle
(2) Thermal resistance from junction to case per leg
4/98
1
2
