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High temperature soldering in accordance with
CECC 802 / Reflow guaranteed
0.380 (9.65)
0.420 (10.67)
0.245 (6.22)
MIN
K
0.160 (4.06)
0.190 (4.83)
0.045 (1.14)
0.055 (1.40)
0.320 (8.13)
0.360 (9.14)
1
K
2
0.575 (14.60)
0.625 (15.88)
0.047 (1.19)
0.055 (1.40)
SEATING
PLATE
-T-
0.090 (2.29)
0.110 (2.79)
0.018 (0.46)
0.025 (0.64)
0.027 (0.686)
0.037 (0.940)
0.080 (2.03)
0.110 (2.79)
0.095 (2.41)
0.100 (2.54)
MECHANICAL DATA
K - HEATSINK
PIN 1
PIN 2
Dimensions in inches and (millimeters)
Case:
JEDEC TO-263 molded plastic body
Terminals:
Leads solderable per MIL-STD-750,
Method 2026
Polarity:
As marked
Mounting Position:
Any
Weight:
0.08 ounces, 2.24 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
SBLB1030
SBLB1040
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at T
C
=110擄C
Peak forward surge current, 8.3ms single
half sine-wave superimposed on rated load
(JEDEC Method)
Maximum instantaneous forward voltage at 10A
(NOTE 1)
Maximum instantaneous reverse current at
rated DC blocking voltage (
NOTE 1)
Typical thermal resistance
(NOTE 2)
V
RRM
V
RMS
V
DC
I
(AV)
30
21
30
10.0
40
28
40
Volts
Volts
Volts
Amps
I
FSM
V
F
I
R
R
螛JC
T
J
,T
STG
250.0
0.55
1.0
50.0
2.0
-40 to +125
Amps
Volts
mA
擄C/W
擄C
T
C
=25擄C
T
C
=100擄C
Operating and storage temperature range
NOTES:
(1) Pulse test: 300碌s pulse width, 1% duty cycle
(2) Thermal resistance from junction to case per leg
7/28/98
1
2
