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High temperature soldering in accordance with
CECC 802 / Reflow guaranteed
0.320 (8.13)
0.360 (9.14)
1
K
2
0.575 (14.60)
0.625 (15.88)
SEATING
PLATE
-T-
0.090 (2.29)
0.110 (2.79)
0.018 (0.46)
0.025 (0.64)
0.027 (0.686)
0.037 (0.940)
0.080 (2.03)
0.110 (2.79)
0.095 (2.41)
0.100 (2.54)
MECHANICAL DATA
PIN 1
K - HEATSINK
PIN 2
Dimensions in inches and (millimeters)
Case:
JEDEC TO-263AB molded plastic body
Terminals:
Lead solderable per MIL-STD-750,
Method 2026
Polarity:
As marked
Mounting Position:
Any
Weight:
0.08 ounce, 2.24 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
SBLB1030CT
SBLB1040CT
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at T
C
=95擄C
Peak forward surge current, 8.3ms single
half sine-wave superimposed on rated load
(JEDEC Method)
Maximum instantaneous forward voltage
per leg at 5.0A
(NOTE 1)
Maximum instantaneous reverse current at
rated DC blocking voltage
(NOTE 1)
Typical thermal resistance
(NOTE 2)
V
RRM
V
RMS
V
DC
I
(AV)
30
21
30
10.0
40
28
40
Volts
Volts
Volts
Amps
I
FSM
175.0
Amps
V
F
T
C
=25擄C
T
C
=100擄C
I
R
R
螛JC
T
J
, T
STG
0.55
0.5
50.0
3.0
-40 to +125
Volts
mA
擄C/W
擄C
Operating and storage temperature range
NOTES:
(1) Pulse test: 300碌s pulse width, 1% duty cycle
(2) Thermal resistance from junction to case per leg
4/98
1
2
