PC133 SDRAM (Rev.0.5)
Oct. '99
64M bit Synchronous DRAM
M2V64S20BTP-6 (4-BANK x 4194304-WORD x 4-BIT)
M2V64S30BTP-6 (4-BANK x 2097152-WORD x 8-BIT)
M2V64S40BTP-6 (4-BANK x 1048576-WORD x 16-BIT)
MITSUBISHI LSIs
PRELIMINARY
Some of contents are described for general products and are
subject to change without notice.
DESCRIPTION
M2V64S20BTP is organized as 4-bank x4,194,304-word x 4-bit,and M2V64S30BTP is organized
as 4-bank x 2097152-word x 8-bit ,and M2V64S40BTP is organized as 4-bank x 1048576-word x 16-bit
Synchronous DRAM with LVTTL interface. All inputs and outputs are referenced to the rising edge of
CLK. M2V64S20BTP,M2V64S30BTP,M2V64S40BTP achieves very high speed data rates up to
133MHz, and is suitable for main memory or graphic memory in computer systems.
FEATURES
ITEM
tCLK
tRAS
tRCD
tAC
tRC
Icc1
Icc6
Clock Cycle Time
(Min.)
(Min.)
(Min.)
(Max.) (CL=3)
(Min.)
M2V64S20TP
M2V64S30TP
M2V64S40TP
-6
7.5ns
45ns
20.0ns
5.4ns
67.5ns
120mA
(Max.)
1mA
Active to Precharge Command Period
Row to Column Delay
Access Time from CLK
Ref/Active Command Period
Operation Current (Max.) [Single Bank]
Self Refresh Current
- Single 3.3V 鹵0.3V power supply
- Max. Clock frequency
-6 : 133MHz [PC133<3-3-3> ]
- Fully synchronous operation referenced to clock rising edge
- 4-bank operation controlled by BA0,BA1(Bank Address)
- /CAS latency- 2/3 (programmable)
- Burst length- 1/2/4/8/FP (programmable)
- Burst type- Sequential and interleave burst (programmable)
- Random column access
- Auto precharge / All bank precharge controlled by A10
- Auto and self refresh
- 4096 refresh cycles /64ms
- LVTTL Interface
- Package 400-mil, 54-pin Thin Small Outline (TSOP II) with 0.8mm lead pitch
MITSUBISHI ELECTRIC
1