SPICE MODELS: S3A S3B S3D S3G S3K S3M S3AB S3BB S3DB S3GB S3KB S3MB
S3A/B - S3M/B
3.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER
Features
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Glass Passivated Die Construction
Low Forward Voltage Drop and High Current Capability
Surge Overload Rating to 100A Peak
Ideally Suited for Automatic Assembly
Lead Free Finish/RoHS Compliant (Note 3)
SMB
Min
3.30
4.06
1.96
0.15
5.00
0.10
0.76
2.00
Max
3.94
4.57
2.21
0.31
5.59
0.20
1.52
2.62
SMC
Min
5.59
6.60
2.75
0.15
7.75
0.10
0.76
2.00
Max
6.22
7.11
3.18
0.31
8.13
0.20
1.52
2.62
B
Dim
A
A
C
B
C
D
Mechanical Data
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Case: SMB/SMC
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Lead Free Plating (Matte Tin Finish).
Solderable per MIL-STD-202, Method 208
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Polarity: Cathode Band or Cathode Notch
Marking: Type Number & Date Code, See Page 2
Ordering Information: See Page 2
Weight: SMB 0.093 grams (approximate)
SMC 0.21 grams (approximate)
D
J
E
G
H
H
G
E
J
All Dimensions in mm
AB, BB, DB, GB, JB, KB, MB Suffix Designates SMB Package
A, B, D, G, J, K, M Designates SMC Package
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
@ T
T
= 75擄C
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
Forward Voltage
Peak Reverse Current
at Rated DC Blocking Voltage
Typical Total Capacitance (Note 1)
Typical Thermal Resistance Junction to Terminal
(Note 2)
Operating and Storage Temperature Range
Notes:
@ T
A
= 25擄C unless otherwise specified
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
I
FSM
V
FM
I
RM
C
T
R
qJT
T
j,
T
STG
S3
A/AB
50
30
S3
B/BB
100
70
S3
D/DB
200
140
S3
G/GB
400
280
3.0
100
1.15
10
250
40
10
-65 to +150
S3
J/JB
600
420
S3
K/KB
800
560
S3
M/MB
1000
700
Unit
V
V
A
A
V
碌A(chǔ)
pF
擄C/W
擄C
@ I
F
= 3.0A
@ T
A
= 25擄C
@ T
A
= 125 擄C
1. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.
2. Thermal resistance: Junction to Terminal, unit mounted on PC board with 5.0 mm
2
(0.013 mm thick) copper pad as heat sink.
3. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see
EU Directive Annex Notes 5 and 7.
DS16005 Rev. 12 - 2
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S3A/B-S3M/B
茫
Diodes Incorporated
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