RSB12Z
Diodes
Low Capacitance Protection Device
RSB12Z
Application
ESD Protection
Dimensions
(Unit : mm)
Land size figure
(Unit : mm)
0.4
0.8鹵0.1
1.2鹵0.1
Features
1) Ultra small mold type. (VMD3)
2) Low capacitance
3) Bi direction
1.2鹵0.1
0.32鹵0.05
(3)
0.13鹵0.05
0.45
0.4
0.5
0錕?frac12;錕?.1
0.8
VMD3
(1)
(2)
0.22鹵0.05
0.5鹵0.05
Construction
Silicon Epitaxial Planar
0.22鹵0.05
0.4
Structure
0.4
ROHM : VMD3
dot(year week factory)
Taping specifications
(Unit : mm)
0.3鹵0.1
4.0鹵0.07
2.0鹵0.04
蠁1.55鹵0.05
1.75鹵0.07
3.5鹵0.05
1.35鹵0.05
銆€0
蠁0.5鹵0.05
1.3鹵0.05
銆€銆€銆€ 0
(4.0鹵0.1)
2.0鹵0.05
0錕?frac12;錕?.1
5.5鹵0.2
8.0鹵0.1
0.6鹵0.05
0
Absolute maximum ratings
(Ta=25擄C)
Parameter
Power dissipation
Junction temperature
Storage temperature
Electrical characteristics
(Ta=25擄C)
Parameter
Zener voltage
Reverse current
Capacitance between terminals
Symbol
V
Z
I
R
C
t
Symbol
P
Tj
Tstg
Limits
150
150
-55 to +150
Unit
mW
鈩?/div>
鈩?/div>
Min.
9.6
-
-
Typ.
-
-
1
Max.
14.4
0.10
-
Unit
V
碌A(chǔ)
pF
Conditions
I
Z
=5mA
V
R
=9V
f=1MHz,V
R
=0V
0.45
1.15
1/2
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