鍚勩儶銉箋儔銇ㄣ倐鍚屽娉?/div>
錛?.1
Each lead has same dimension
0.16鹵0.1
0.06
1.6
2.8鹵0.2
錛?.2
錛?.1
Features
1)Small mold type. (TSMD5)
2) High reliability
0 .0 5 鹵0 .0 4
0.45 0.35
0.7
0.35 0.45
0錕?frac12;錕?.1
0.95
0.3錕?frac12;錕?.6
Construction
Silicon epitaxial planar
(1)
0.95
(2)
0.95
(3)
0.33鹵0.03
0.7鹵0.1
0.85鹵0.1
1.0Max
TSMD5
0.95
1.9
Structure
1.9鹵0.2
ROHM : TSMD5
dot (year week factory) + day
Taping dimensions
(Unit : mm)
4.0鹵0.1
2.0鹵0.05
蠁1.55鹵0.05
0.3鹵0.1
1.75鹵0.1
3.5鹵0.05
3.2鹵0.08
8.0鹵0.2
3.2鹵0.08
4.0鹵0.1
蠁1.1鹵0.1
0錕?frac12;錕?.5
5.5鹵0.2
3.2鹵0.08
1.1鹵0.08
Absolute maximum ratings
(Ta=25擄C)
Parameter
Reverse voltage (repetitive peak)
Average rectified forward current
Forward current surge peak
錛?0Hz銉?cyc錛?/div>
Junction temperature
Storage temperature
Symbol
V
R
Io
I
FSM
Tj
Tstg
Limits
400
0.5
8
150
-55 to +150
Unit
V
A
A
鈩?/div>
鈩?/div>
Electrical characteristic
(Ta=25擄C)
Parameter
Forward voltage
Reverse current
Symbol
V
F
I
R
Min.
-
-
Typ.
-
-
Max.
1.1
10
Unit
V
uA
Conditions
I
F
=0.5A
V
R
=400V
2.4
(5)
(4)
1.0 min.
1/3
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