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High temperature soldering guaranteed:
350擄C/10 seconds 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
P
A
T
E
N
T
E
Dimensions in inches and (millimeters)
*
Glass-plastic encapsulation technique is covered by
Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930,306
MECHANICAL DATA
Case:
JEDEC DO-204AL molded plastic over glass body
Terminals:
Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.012 ounce, 0.3 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
RGP
10A
RGP
10B
RGP
10D
RGP
10G
RGP
10J
RGP
10K
RGP
10M
UNITS
Maximum recurrent peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.375" (9.5mm) lead length at T
A
=55擄C
Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
Maximum instantaneous forward voltage at 1.0A
Maximum full load reverse current, full cycle average
0.375" (9.5mm) lead length T
A
=55擄C
Maximum DC reverse current
at rated DC blocking voltage
Maximum reverse recovery time
(NOTE 1)
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
V
F
I
R
I
R
t
rr
C
J
R
螛JA
T
J
, T
STG
50
35
50
100
70
100
200
140
200
400
280
400
1.0
30.0
1.3
100.0
5.0
200.0
600
420
600
800
560
800
1000
700
1000
Volts
Volts
Volts
Amp
Amps
Volts
碌A(chǔ)
碌A(chǔ)
T
A
=25擄C
T
A
=150擄C
150
15.0
55.0
-65 to +175
250
500
ns
pF
擄C/W
擄C
Typical junction capacitance
(NOTE 2)
Typical thermal resistance
(NOTE 3)
Operating junction and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, P.C.B. mounted
1
2
