鈾?/div>
High temperature soldering guaranteed:
350擄C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
P
A
T
E
N
T
*
MECHANICAL DATA
Dimensions in inches and (millimeters)
*
Brazed-lead assembly is covered by Patent No. 3,930,306
Case:
Solid glass body
Terminals:
Solder plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.037 ounce, 1.04 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
RG4A
RG4B
RG4D
RG4G
RG4J
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.375鈥?(9.5mm) lead lengths at T
A
=55擄C
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method)
Maximum instantaneous forward voltage at 3.0A
Maximum reverse current
at rated DC blocking voltage
Maximum average reverse current
at peak reverse voltage
Maximum reverse recovery time
Typical thermal resistance
(NOTE 1)
V
RRM
V
RMS
V
DC
I
(AV)
50
35
50
100
70
100
200
140
200
3.0
400
280
400
600
420
600
Volts
Volts
Volts
Amps
I
FSM
V
F
I
R
T
A
=25擄C
T
A
=100擄C
I
R(AV)
t
rr
C
J
R
螛JA
T
J
, T
STG
100.0
1.3
5.0
2.0
100.0
150
50.0
22.0
-65 to +175
250
Amps
Volts
碌A
碌A
ns
pF
擄C/W
擄C
Typical junction capacitance
(NOTE 2)
(NOTE 3
)
Operating junction and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, with both leads to heat sink
4/98
1
2
