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RF2488 Datasheet

  • RF2488

  • MULTI-MODE DUAL-BAND LNA MIXER

  • 484.96KB

  • 22頁

  • RFMD

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Preliminary
RF2488
MULTI-MODE DUAL-BAND LNA MIXER
8
Typical Applications
鈥?TDMA/EDGE Handsets
鈥?TDMA IS-136 Handsets
鈥?GAIT Handsets
鈥?TDMA/GSM Dual-Band Handsets
鈥?GSM/DCS/EDGE Handsets
Product Description
The RF2488 is a dual-band LNA/Mixer designed to sup-
port dual-band, multi-mode handset applications. The
unique dual IF outputs provide interface to two indepen-
dent IF SAW filters supporting applications that combine
IS136 with GSM, DCS or EDGE air interfaces. The device
includes four mixers, providing the ability to use two inde-
pendent IF bandwidths accessible from either the low or
high band LNAs. Each LNA has a gain bypass mode con-
trolled by the GAIN SEL pin. An image reject filter is
required between each LNA and its mixer. Power man-
agement is implemented based on a three-pin logic level
interface. Power consumption is minimized by shutting
down all but the active sections of the device.
.80
.65
1.00
0.85
4.00
sq.
.60
typ
.24
.45
.20
4 PLCS
2.25
sq.
1.95
12擄
max
.05
.01
.55
.30
.40
2
.28
.50
.23
.13
4 PLCS
Optimum Technology Matching廬 Applied
Si BJT
Si Bi-CMOS
Package Style: LCC, 24-Pin, 4x4
眉
SiGe HBT
VCC BIAS
Low
LNA OUT
Low
LNA VCC
24
23
22
GaAs HBT
GaAs MESFET
Si CMOS
Features
鈥?Complete Dual-Band Front-End
鈥?Switchable LNA Gain
鈥?Low Noise and High Intercept Point
鈥?Low Current Consumption
鈥?Single 2.7V to 3.3V Power Supply
鈥?Supports Dual IF Bandwidths
Low
MIX IN
TX/RX
21
20
Low
LNA GND
GAIN SEL
Low
LNA IN
High
LNA IN
High
LNA GND
High
LNA VCC
1
2
3
4
5
6
7
High
LNA OUT
8
GND
9
IF OUT SEL
10
High
MIX IN
11
NC
12
Low
LO IN
19
18
BAND SEL
17 IF1+
16 IF1-
15 MXR VCC
14 IF2+
13 IF2-
Ordering Information
RF2488
RF2488 PCBA
Multi-Mode Dual-Band LNA Mixer
Fully Assembled Evaluation Board
Functional Block Diagram
High
LO IN
RF Micro Devices, Inc.
7625 Thorndike Road
Greensboro, NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Rev A0 010905
8-123
FRONT-ENDS
NOTES:
1 Shaded Pin is Lead 1.
2 Dimension applies to plated terminal: to be measured between 0.02 mm
and 0.25 mm from terminal end.
3 Pin 1 identifier must exist on top surface of package by identification
mark or feature on the package body. Exact shape and size is optional.
4 Package Warpage: 0.05 mm max.
5 Die Thickness Allowable: 0.305 mm max.
8

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