音影先锋亚洲天堂网|电影世界尽头的爱完整版播放|国产 熟女 91|高清无码免费观看欧美日韩|韩国一区二区三区黄色录像|美女亚洲加勒比在线|亚洲综合网 开心五月|7x成人在线入口|成人网站免费日韩毛片区|国产黄片?一级?二级?三级

RD38F1020C0ZTL0 Datasheet

  • RD38F1020C0ZTL0

  • 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked...

  • 70頁(yè)

  • INTEL   INTEL

掃碼查看芯片數(shù)據(jù)手冊(cè)

上傳產(chǎn)品規(guī)格書

PDF預(yù)覽

3 Volt Intel
廬
Advanced+ Boot Block
Flash Memory (C3) Stacked-Chip Scale
Package Family
Datasheet
Product Features
鈻?/div>
鈻?/div>
鈻?/div>
鈻?/div>
Flash Memory Plus SRAM
鈥?Reduces Memory Board Space
Required, Simplifying PCB Design
Complexity
Stacked-Chip Scale Package (Stacked-
CSP) Technology
鈥?Smallest Memory Subsystem Footprint
鈥?Area : 8 x 10 mm for 16Mbit (0.13 碌m)
Flash + 2Mbit or 4Mbit SRAM
鈥?Area : 8 x 12 mm for 32Mbit (0.13 碌m)
Flash + 4Mbit or 8Mbit SRAM
鈥?Height : 1.20 mm for 16Mbit (0.13 碌m)
Flash + 2Mbit or 4Mbit SRAM and
32Mbit (0.13um) Flash + 8Mbit SRAM
鈥?Height : 1.40 mm for 32Mbit (0.13 碌m)
Flash + 4Mbit SRAM
鈥?This Family also includes 0.25 碌m and
0.18 碌m technologies
Advanced SRAM Technology
鈥?70 ns Access Time
鈥?Low Power Operation
鈥?Low Voltage Data Retention Mode
Intel
廬
Flash Data Integrator (FDI)
Software
鈥?Real-Time Data Storage and Code
Execution in the Same Memory Device
鈥?Full Flash File Manager Capability
鈻?/div>
鈻?/div>
鈻?/div>
鈻?/div>
Advanced+ Boot Block Flash Memory
鈥?70 ns Access Time at 2.7 V
鈥?Instant, Individual Block Locking
鈥?128 bit Protection Register
鈥?12 V Production Programming
鈥?Ultra Fast Program and Erase Suspend
鈥?Extended Temperature 鈥?5 擄C to +85 擄C
Blocking Architecture
鈥?Block Sizes for Code + Data Storage
鈥?4-Kword Parameter Blocks (for data)
鈥?64-Kbyte Main Blocks (for code)
鈥?100,000 Erase Cycles per Block
Low Power Operation
鈥?Async Read Current: 9 mA (Flash)
鈥?Standby Current: 7 碌A(chǔ) (Flash)
鈥?Automatic Power Saving Mode
Flash Technologies
鈥?0.25 碌m ETOX鈩?VI, 0.18 碌m ETOX鈩?/div>
VII and 0.13 碌m ETOX鈩?VIII Flash
Technologies
鈥?28F160xC3, 28F320xC3
The 3 Volt Intel
廬
Advanced+ Boot Block Flash Memory (C3) Stacked-Chip Scale Package
(Stacked-CSP) device delivers a feature-rich solution for low-power applications. The C3
Stacked-CSP memory device incorporates flash memory and static RAM in one package with
low voltage capability to achieve the smallest system memory solution form-factor together with
high-speed, low-power operations. The C3 Stacked-CSP memory device offers a protection
register and flexible block locking to enable next generation security capability. Combined with
the Intel
廬
Flash Data Integrator (Intel
廬
FDI) software, the C3 Stacked-CSP memory device
provides a cost-effective, flexible, code plus data storage solution.
Notice:
This document contains information on new products in production. The specifications
are subject to change without notice. Verify with your local Intel sales office that you have the lat-
est datasheet before finalizing a design.
252636-001
February, 2003

RD38F1020C0ZTL0相關(guān)型號(hào)PDF文件下載

掃碼下載APP，
一鍵連接廣大的電子世界。

在線人工客服

買家服務(wù)：
賣家服務(wù)：
技術(shù)客服：

0571-85317607

網(wǎng)站技術(shù)支持

13606545031

客服在線時(shí)間周一至周五
9:00-17:30

關(guān)注官方微信號(hào)，
第一時(shí)間獲取資訊。

建議反饋

聯(lián)系人：

聯(lián)系方式：

按住滑塊，拖拽到最右邊
>>
感謝您向阿庫(kù)提出的寶貴意見，您的參與是維庫(kù)提升服務(wù)的動(dòng)力！意見一經(jīng)采納，將有感恩紅包奉上哦！