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RD28F3208C3T90 Datasheet

  • RD28F3208C3T90

  • 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked...

  • 70頁(yè)

  • INTEL   INTEL

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3 Volt Intel
廬
Advanced+ Boot Block
Flash Memory (C3) Stacked-Chip Scale
Package Family
Datasheet
Product Features
鈻?/div>
鈻?/div>
鈻?/div>
鈻?/div>
Flash Memory Plus SRAM
鈥?Reduces Memory Board Space
Required, Simplifying PCB Design
Complexity
Stacked-Chip Scale Package (Stacked-
CSP) Technology
鈥?Smallest Memory Subsystem Footprint
鈥?Area : 8 x 10 mm for 16Mbit (0.13 碌m)
Flash + 2Mbit or 4Mbit SRAM
鈥?Area : 8 x 12 mm for 32Mbit (0.13 碌m)
Flash + 4Mbit or 8Mbit SRAM
鈥?Height : 1.20 mm for 16Mbit (0.13 碌m)
Flash + 2Mbit or 4Mbit SRAM and
32Mbit (0.13um) Flash + 8Mbit SRAM
鈥?Height : 1.40 mm for 32Mbit (0.13 碌m)
Flash + 4Mbit SRAM
鈥?This Family also includes 0.25 碌m and
0.18 碌m technologies
Advanced SRAM Technology
鈥?70 ns Access Time
鈥?Low Power Operation
鈥?Low Voltage Data Retention Mode
Intel
廬
Flash Data Integrator (FDI)
Software
鈥?Real-Time Data Storage and Code
Execution in the Same Memory Device
鈥?Full Flash File Manager Capability
鈻?/div>
鈻?/div>
鈻?/div>
鈻?/div>
Advanced+ Boot Block Flash Memory
鈥?70 ns Access Time at 2.7 V
鈥?Instant, Individual Block Locking
鈥?128 bit Protection Register
鈥?12 V Production Programming
鈥?Ultra Fast Program and Erase Suspend
鈥?Extended Temperature 鈥?5 擄C to +85 擄C
Blocking Architecture
鈥?Block Sizes for Code + Data Storage
鈥?4-Kword Parameter Blocks (for data)
鈥?64-Kbyte Main Blocks (for code)
鈥?100,000 Erase Cycles per Block
Low Power Operation
鈥?Async Read Current: 9 mA (Flash)
鈥?Standby Current: 7 碌A(chǔ) (Flash)
鈥?Automatic Power Saving Mode
Flash Technologies
鈥?0.25 碌m ETOX鈩?VI, 0.18 碌m ETOX鈩?/div>
VII and 0.13 碌m ETOX鈩?VIII Flash
Technologies
鈥?28F160xC3, 28F320xC3
The 3 Volt Intel
廬
Advanced+ Boot Block Flash Memory (C3) Stacked-Chip Scale Package
(Stacked-CSP) device delivers a feature-rich solution for low-power applications. The C3
Stacked-CSP memory device incorporates flash memory and static RAM in one package with
low voltage capability to achieve the smallest system memory solution form-factor together with
high-speed, low-power operations. The C3 Stacked-CSP memory device offers a protection
register and flexible block locking to enable next generation security capability. Combined with
the Intel
廬
Flash Data Integrator (Intel
廬
FDI) software, the C3 Stacked-CSP memory device
provides a cost-effective, flexible, code plus data storage solution.
Notice:
This document contains information on new products in production. The specifications
are subject to change without notice. Verify with your local Intel sales office that you have the lat-
est datasheet before finalizing a design.
252636-001
February, 2003

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