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11 鹵 0.2
1.0 鹵 0.1
MECHANICAL DATA :
* Case : Reliable low cost construction
utilizing molded plastic technique
* Epoxy : UL94V-O rate flame retardant
* Terminals : Plated lead solderable per
MIL-STD-202, Method 208 guaranteed
* Polarity : Polarity symbols marked on case
* Mounting position : Any
* Weight : 7.7 grams
Rating at 25
擄C
ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
10
7.5 7.5
鹵0.2 鹵0.2 鹵0.2
2.0 鹵 0.2
0.7 鹵 0.1
Dimensions in millimeters
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
RATING
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Current Tc = 55擄C
Peak Forward Surge Current Single half sine wave
Superimposed on rated load (JEDEC Method)
Current Squared Time at t < 8.3 ms.
Maximum Forward Voltage per Diode at I
F
= 8.0 Amps.
Maximum DC Reverse Current
at Rated DC Blocking Voltage
Ta = 25
擄C
Ta = 100
擄C
SYMBOL
V
RRM
V
RMS
V
DC
I
F(AV)
RBV
800D
50
35
50
RBV
801D
100
70
100
RBV
802D
200
140
200
RBV
804D
400
280
400
8.0
RBV
806D
600
420
600
RBV
808D
800
560
800
17.5 鹵 0.5
RBV
810D
1000
700
1000
UNIT
Volts
Volts
Volts
Amps.
I
FSM
I
2
t
V
F
I
R
I
R(H)
R
胃
JC
R
胃
JA
T
J
T
STG
300
166
1.0
10
200
2.2
15
- 40 to + 150
- 40 to + 150
Amps.
A
2
S
Volts
碌A(chǔ)
碌A(chǔ)
擄C/W
擄C/W
擄C
擄C
Typical Thermal Resistance (Note 1)
Typical Thermal Resistance at Junction to Ambient
Operating Junction Temperature Range
Storage Temperature Range
Notes :
1. Thermal Resistance from junction to case with units mounted on a 3.2"x3.2"x0.12" THK (8.2cm.x8.2cm.x0.3cm.) Al. Plate. heatsink.
UPDATE : AUGUST 3, 1998