鈭?/div>
3.2
鹵
0.1
20
鹵
0.3
+
13.5
鹵
0.3
~ ~
11
鹵
0.2
1.0
鹵
0.1
MECHANICAL DATA :
* Case : Reliable low cost construction
utilizing molded plastic technique
* Epoxy : UL94V-O rate flame retardant
* Terminals : Plated lead solderable per
MIL-STD-202, Method 208 guaranteed
* Polarity : Polarity symbols marked on case
* Mounting position : Any
* Weight : 7.7 grams
10
7.5 7.5
2.0
鹵
0.2
0.7
鹵
0.1
鹵
0.2
鹵
0.2
鹵
0.2
Dimensions in millimeters
Rating at 25
擄
C ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
RATING
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Current Tc = 55
擄
C
Peak Forward Surge Current Single half sine wave
Superimposed on rated load (JEDEC Method)
Current Squared Time at t < 8.3 ms.
Maximum Forward Voltage per Diode at I
F
= 3.0 Amps.
Maximum DC Reverse Current
at Rated DC Blocking Voltage
Ta = 25
擄
C
Ta = 100
擄
C
SYMBOL
RBV
600
50
35
50
RBV
601
100
70
100
RBV
602
200
140
200
RBV
604
400
280
400
6.0
RBV
606
600
420
600
17.5
鹵
0.5
RBV
608
800
560
800
RBV
610
1000
700
1000
UNIT
Volts
Volts
Volts
Amps.
Amps.
A
2
S
Volts
碌
A
碌
A
擄
C/W
擄
C
擄
C
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
I
2
t
V
F
I
R
I
R(H)
R
胃
JC
T
J
T
STG
200
64
1.0
10
200
8.0
- 40 to + 150
- 40 to + 150
Typical Thermal Resistance (Note 1)
Operating Junction Temperature Range
Storage Temperature Range
Notes :
1. Thermal Resistance from junction to case w ith units mounted on a 2.6"x1.4"x0.06" THK (6.5cm.x3.5cm.x0.15cm.) Al. Plate. Heatsink.
UPDATE : MARCH 6, 2000
1
2
