鍚屽娉?/div>
Each lead has same dimension
0.15
錛?.06
(3)
2.8鹵0.2
1.6
錛?.1
Features
1) Small mold type. (SMD3)
2) Low I
R
3) High reliability.
0.4
錛?.1
銆€錛?.05
錛?.2
1.0MIN.
0.95
0.8MIN.
0錕?frac12;錕?.1
0.3錕?frac12;錕?.6
(2)
0.95
0.95
1.9鹵0.2
(1)
0.8鹵0.1
1.1鹵0.2
0.01
Structure
Construction
Silicon epitaxial planar
ROHM : SMD3
JEDEC :S0T-346
JEITA : SC-59
week code
Taping specifications(Unit
: mm)
4.0鹵0.1
2.0鹵0.05
蠁1.5鹵0.1
銆€銆€銆€銆€銆€ 0
1.75鹵0.1
0.3鹵0.1
3.5鹵0.05
8.0鹵0.2
3.2鹵0.1
3.2鹵0.1
4.0鹵0.1
蠁1.05MIN
0錕?frac12;錕?.5
5.5鹵0.2
3.2鹵0.1
1.35鹵0.1
Absolute maximum ratings
(Ta=25擄C)
Parameter
Reverse voltage (repetitive peak)
Reverse voltage (DC)
Average rectified forward current (*1)
Forward current surge peak
錛?0Hz銉?cyc錛?/div>
(*1)
Junction temperature
Storage temperature
(*1) Rating of per diode : Io/2
Symbol
V
RM
V
R
Io
I
FSM
Tj
Tstg
Limits
45
40
30
200
125
-40 to +125
Unit
V
V
mA
mA
鈩?/div>
鈩?/div>
Electrical characteristics
(Ta=25擄C)
Parameter
Forward voltage
Reverse current
Capacitance between terminals
Symbol
V
F
1
I
R
1
Ct1
Min.
-
-
-
Typ.
-
-
2.0
Max.
0.37
1
-
Unit
V
碌A(chǔ)
pF
Conditions
I
F
=1mA
V
R
=10V
V
R
=1V , f=1MHz
2.4
錛?.1
Rev.B
1/3
next