鍚屽娉?/div>
0.15
錛?.06
2.8鹵0.2
1.6
錛?.1
Features
1) Small mold type. (SMD3)
2) Low I
R
3) High reliability.
0.4
錛?.1
錛?.2
1.0MIN.
(3)
0.95
0錕?frac12;錕?.1
0.3錕?frac12;錕?.6
0.8MIN.
(2)
(1)
0.95
1.9鹵0.2
0.8鹵0.1
1.1鹵0.2
0.01
SMD3
Structure
Silicon epitaxial planar
0.95
Structure
ROHM : SMD3
JEDEC :S0T-346
JEITA : SC-59
week code
Taping dimensions
(Unit : mm)
4.0鹵0.1
2.0鹵0.05
蠁1.5鹵0.1
銆€銆€銆€銆€銆€ 0
1.75鹵0.1
0.3鹵0.1
3.5鹵0.05
8.0鹵0.2
3.2鹵0.1
3.2鹵0.1
4.0鹵0.1
蠁1.05MIN
0錕?frac12;錕?.5
5.5鹵0.2
3.2鹵0.1
1.35鹵0.1
Absolute maximum ratings
(Ta=25擄C)
Parameter
Reverse voltage (repetitive peak)
Reverse voltage (DC)
Average rectified forward current錛?1錛?/div>
Forward current surge peak
錛?0Hz銉?cyc錛夛紙*1錛?/div>
Junction temperature
Storage temperature
(*1)Rating of per diode
Electrical characteristics
(Ta=25擄C)
Parameter
Symbol
V
RM
V
R
Io
I
FSM
Tj
Tstg
Limits
40
40
100
1
125
-40 to +125
Unit
V
V
mA
A
鈩?/div>
鈩?/div>
Forward voltage
Reverse current
Capacitance between terminals
Symbol
V
F
1
V
F
2
I
R
1
Ct1
Min.
-
-
-
-
Typ.
-
-
-
6
Max.
0.55
0.34
30
-
Unit
V
V
碌A(chǔ)
pF
Conditions
I
F
=100mA
I
F
=10mA
V
R
=10V
V
R
=10V , f=1MHz
Rev.A
2.4
銆€錛?.05
錛?.1
1/3
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