SPICE MODEL: QZX563C6V8C
QZX563C6V8C
Lead-free Green
QUAD SURFACE MOUNT TVS ARRAY
Features
NEW PRODUCT
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Quad TVS in Common Anode Configuration
Nominal Zener Voltage: 6.8V
Ultra-Small Surface Mount Package
Ideal For Transient Suppression
Lead Free By Design/RoHS Compliant (Note 1)
"Green Device" (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
G
D
B C
A
SOT-563
Dim
A
B
C
D
G
0.90
1.50
0.56
0.10
0.10
H
K
L
L
Min
0.15
1.10
1.55
Max
0.30
1.25
1.70
0.50
1.10
1.70
0.60
0.30
0.18
Typ
0.25
1.20
1.60
1.00
1.60
0.60
0.20
戮
ESD Capability
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IEC 61000-4-2 Contact Method:
鹵8kV
IEC 61000-4-2 Air Discharge Method:
鹵25kV
K
H
M
Mechanical Data
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Case: SOT-563
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Finish: Matte Tin, Annealed Over Copper
Leadframe. Solderable per MIL-STD-202, Method 208
Orientation: See Diagram
Marking: See Table Below
Weight: 0.003 grams (approximate)
Ordering Information: See Page 2
@T
A
= 25擄C unless otherwise specified
Symbol
V
F
V
F
P
d
P
pk
R
qJA
T
j,
T
STG
C
4
A
C
3
C
1
NC
M
All Dimensions in mm
C
2
Maximum Ratings
Characteristic
Forward Voltage @ I
F
= 10mA (Note 3)
Forward Voltage @ I
F
= 100mA (Note 3)
Power Dissipation (Note 4)
Peak Power Dissipation, 10x1000mS Waveform (Note 5)
Peak Power Dissipation, 8x20mS Waveform (Note 5)
Thermal Resistance, Junction-to-Ambient (Note 4)
Operating and Storage Temperature Range
Value
0.9
1.0
150
10
80
833
-65 to +150
Unit
V
V
mW
W
擄C/W
擄C
Electrical Characteristics
@T
A
= 25擄C unless otherwise specified
Breakdown Voltage
(Note 3)
V
BR
@ I
T
= 1mA
Min (V)
6.47
Nom (V)
6.8
Max (V)
7.14
mA
1.0
Maximum Reverse
Current
(Note 3)
I
R
@ V
R
V
3.0
Typical Junction
Capacitance
C
T
@ V
R
= 0V,
f = 1MHz
pF
63
Reverse Standoff Voltage
and Leakage
Type
Number
Marking
Code
V
RWM
V
QZX563C6V8C
Note:
1.
2.
3.
4.
I
R
@ V
RWM
mA
1.5
CB
5
No purposefully added lead.
Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
Short duration pulse test used to minimize self-heating effect.
Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. Suggested Pad Layout Document AP02001,
which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
5. Non-repetitive current pulse per Figure 2 and derate above T
A
= 25擄C per Figure 1.
DS30716 Rev. 3 - 2
1 of 3
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QZX563C6V8C
茫
Diodes Incorporated
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