PLASTIC SILICON INFRARED
PHOTOTRANSISTOR
QSC112
PACKAGE DIMENSIONS
0.116 (2.95)
REFERENCE
SURFACE
0.052 (1.32)
0.032 (0.082)
0.193 (4.90)
QSC113
QSC114
0.030 (0.76)
NOM
0.800 (20.3)
MIN
0.050 (1.27)
EMITTER
0.100 (2.54)
NOM
SCHEMATIC
COLLECTOR
0.155 (3.94)
0.018 (0.46)
SQ. (2X)
NOTES:
1. Dimensions for all drawings are in inches (mm).
2. Tolerance of 鹵 .010 (.25) on all non-nominal dimensions
unless otherwise specified.
EMITTER
DESCRIPTION
The QSC112/113/114 is a silicon phototransistor encapsulated in an infrared transparent, black T-1 package.
FEATURES
鈥?Tight production distribution.
鈥?Steel lead frames for improved reliability in solder mounting.
鈥?Good optical-to-mechanical alignment.
鈥?Plastic package is infrared transparent black to attenuate visible light.
鈥?Mechanically and spectrally matched to the QECXXX LED.
鈥?Black plastic body allows easy recognition from LED.
錚?/div>
2001 Fairchild Semiconductor Corporation
DS300358
7/09/01
1 OF 4
www.fairchildsemi.com
next