SQ. (4X)
1. Derate power dissipation linearly 1.33 mW/擄C above 25擄C.
2. RMA flux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning
agents.
4. Soldering iron
1/16鈥?/div>
(1.6mm) from housing.
5. As long as leads are not under any spring tension.
6. D is the distance from the sensor face to the reflective surface.
7. Cross talk (I
CX
) is the collector current measured with the
indicator current on the input diode and with no reflective surface.
8. Measured using an Eastman Kodak neutral white test card with
90% diffused reflecting as a reflective surface.
0.083 (2.11)
PIN 1 COLLECTOR
PIN 2 EMITTER
PIN 3 ANODE
PIN 4 CATHODE
SCHEMATIC
2
3
NOTES:
1. Dimensions for all drawings are in inches (millimeters).
2. Tolerance of 鹵 .010 (.25) on all non-nominal dimensions
unless otherwise specified.
3. Pins 2 and 4 typically .050鈥?shorter than pins 1 and 3.
4. Dimensions controlled at housing surface.
1
4
ABSOLUTE MAXIMUM RATINGS
Parameter
Operating Temperature
Storage Temperature
Lead Temperature (Solder Iron)
(2,3)
Lead Temperature (Solder Flow)
(2,3)
EMITTER
Continuous Forward Current
Reverse Voltage
Power Dissipation
(1)
SENSOR
Collector-Emitter Voltage
Emitter-Collector Voltage
Power Dissipation
(1)
(T
A
= 25擄C unless otherwise specified)
Symbol
T
OPR
T
STG
T
SOL-I
T
SOL-F
I
F
V
R
P
D
V
CEO
V
ECO
P
D
100
Rating
-40 to +85
-40 to +85
240 for 5 sec
260 for 10 sec
50
5
100
30
Units
擄C
擄C
擄C
擄C
mA
V
mW
V
V
mW
1 of 4
100030A