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Low Power dissipation
max. 450 mW active (-50 version)
max. 432 mW active (-55 version)
max. 378 mW active (-60 version)
Standby power dissipation
7.2 mW standby (TTL)
3.6 mW max. standby (CMOS)
0.72 mW max. standby (CMOS) for
Low Power Version
Output unlatched at cycle end allows two-
dimensional chip selection
Read, write, read-modify write, CAS-
before-RAS refresh, RAS-only refresh,
hidden-refresh and hyper page (EDO)
mode capability
2 CAS / 1 WE control
Self Refresh (L-Version)
All inputs and outputs TTL-compatible
512 refresh cycles / 16 ms
512 refresh cycles / 128 ms
Low Power Version only
Plastic Packages:
P-SOJ-40-1 400mil width
The HYB 314175BJ/BJL is the new generation dynamic RAM organized as 262 144 words by
16-bit. The HYB 314175BJ/BJL utilizes CMOS silicon gate process as well as advanced circuit
techniques to provide wide operation margins, both internally and for the system user. Multiplexed
address inputs permit the HYB 314175BJ/BJL to be packed in a standard plastic 400mil wide
P-SOJ-40-1 package. This package size provides high system bit densities and is compatible with
commonly used automatic testing and insertion equipment. System oriented features include Self
Refresh (L-Version), single + 3.3 V (鹵 0.3 V) power supply, direct interfacing with high performance
logic device families.
Semiconductor Group
1
7.96