Silicon Switching Diode Array
q
Bridge configuration
q
High-speed switch diode chip
BGX 50 A
Type
BGX 50 A
Marking
U1s
Ordering Code
(tape and reel)
Q62702-G38
Pin Configuration
Package
1)
SOT-143
Maximum Ratings per Diode
Parameter
Reverse voltage
Peak reverse voltage
Forward current
Total power dissipation,
T
S
= 74 藲C
Junction temperature
Storage temperature range
Thermal Resistance
Junction - ambient
2)
Junction - soldering point
R
th JA
R
th JS
鈮?/div>
640
鈮?/div>
360
Symbol
V
R
V
RM
I
F
P
tot
T
j
T
stg
Values
50
70
140
210
150
鈥?65 鈥?+ 150
Unit
V
mA
mW
藲C
K/W
1)
2)
For detailed information see chapter Package Outlines.
Package mounted on epoxy pcb 40 mm
脳
40 mm
脳
1.5 mm/6 cm
2
Cu.
Semiconductor Group
1
5.91
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