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PZT751T1G Datasheet

  • PZT751T1G

  • PNP Silicon Planar Epitaxial Transistor

  • 6頁(yè)

  • ONSEMI

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PZT751T1
Preferred Device
PNP Silicon Planar
Epitaxial Transistor
This PNP Silicon Epitaxial transistor is designed for use in
industrial and consumer applications. The device is housed in the
SOT鈭?23 package which is designed for medium power surface
mount applications.
Features
http://onsemi.com
鈥?/div>
High Current: 2.0 A
鈥?/div>
The SOT鈭?23 Package can be soldered using wave or reflow.
鈥?/div>
SOT鈭?23 package ensures level mounting, resulting in improved
thermal conduction, and allows visual inspection of soldered joints.
The formed leads absorb thermal stress during soldering, eliminating
the possibility of damage to the die
鈥?/div>
NPN Complement is PZT651T1
鈥?/div>
Pb鈭扚ree Package is Available
MAXIMUM RATINGS
(T
C
= 25擄C unless otherwise noted)
Rating
Collector鈭扙mitter Voltage
Collector鈭払ase Voltage
Emitter鈭払ase Voltage
Collector Current
Total Power Dissipation @ T
A
= 25擄C
(1)
Derate above 25擄C
Storage Temperature Range
Junction Temperature
Symbol
V
CEO
V
CBO
V
EBO
I
C
P
D
T
stg
T
J
Value
60
80
5.0
2.0
0.8
6.4
鈭?5
to 150
150
Unit
Vdc
Vdc
Vdc
Adc
W
mW/擄C
擄C
擄C
SOT鈭?23 PACKAGE
HIGH CURRENT
PNP SILICON TRANSISTOR
SURFACE MOUNT
COLLECTOR 2, 4
BASE
1
EMITTER 3
MARKING
DIAGRAM
TO鈭?61AA
CASE 318E
STYLE 1
D
ZT 751
THERMAL CHARACTERISTICS
Rating
Thermal Resistance from Junction鈭抰o鈭?/div>
Ambient in Free Air
Maximum Temperature for Soldering
Purposes
Time in Solder Bath
Symbol
R
qJA
T
L
Value
156
260
10
Unit
擄C/W
擄C
Sec
ZT 751 = Specific Device Code
D
= Date Code
ORDERING INFORMATION
Device
PZT751T1
PZT751T1G
Package
SOT鈭?23
SOT鈭?23
(Pb鈭扚ree)
Shipping
1000 / Tape & Reel
1000 / Tape & Reel
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Device mounted on a FR鈭? glass epoxy printed circuit board using minimum
recommended footprint.
鈥燜or information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred
devices are recommended choices for future use
and best overall value.
錚?/div>
Semiconductor Components Industries, LLC, 2004
January, 2004
鈭?/div>
Rev. 4
1
Publication Order Number:
PZT751T1/D

PZT751T1G 產(chǎn)品屬性

  • 1,000

  • 分離式半導(dǎo)體產(chǎn)品

  • 晶體管(BJT) - 單路

  • -

  • PNP

  • 2A

  • 60V

  • 500mV @ 200mA，2A

  • -

  • 75 @ 1A，2V

  • 800mW

  • 75MHz

  • 表面貼裝

  • TO-261-4，TO-261AA

  • SOT-223

  • 帶卷 (TR)

  • PZT751T1GOSPZT751T1GOS-NDPZT751T1GOSTR

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