Philips Semiconductors
Product specification
PowerMOS transistor
PHX1N40
GENERAL DESCRIPTION
N-channel enhancement mode
field-effect power transistor in a full
pack plastic envelope featuring high
avalanche energy capability, stable
off-state
characteristics,
fast
switching and high thermal cycling
performance with low thermal
resistance. Intended for use in
Switched Mode Power Supplies
(SMPS), motor control circuits and
general
purpose
switching
applications.
QUICK REFERENCE DATA
SYMBOL
V
DS
I
D
P
tot
R
DS(ON)
PARAMETER
Drain-source voltage
Drain current (DC)
Total power dissipation
Drain-source on-state resistance
MAX.
400
1.7
25
3.5
UNIT
V
A
W
鈩?/div>
PINNING - SOT186A
PIN
1
2
3
gate
drain
source
DESCRIPTION
PIN CONFIGURATION
case
SYMBOL
d
g
case isolated
1 2 3
s
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER
I
D
I
DM
P
D
鈭哖
D
/鈭員
mb
V
GS
E
AS
I
AS
T
j
, T
stg
Continuous drain current
Pulsed drain current
Total dissipation
Linear derating factor
Gate-source voltage
Single pulse avalanche
energy
Peak avalanche current
Operating junction and
storage temperature range
CONDITIONS
T
hs
= 25 藲C; V
GS
= 10 V
T
hs
= 100 藲C; V
GS
= 10 V
T
hs
= 25 藲C
T
hs
= 25 藲C
T
hs
> 25 藲C
V
DD
鈮?/div>
50 V; starting T
j
= 25藲C; R
GS
= 50
鈩?
V
GS
= 10 V
V
DD
鈮?/div>
50 V; starting T
j
= 25藲C; R
GS
= 50
鈩?
V
GS
= 10 V
MIN.
-
-
-
-
-
-
-
-
- 55
MAX.
1.7
1.1
7
25
0.2
鹵
30
100
2.5
150
UNIT
A
A
A
W
W/K
V
mJ
A
藲C
ISOLATION LIMITING VALUE & CHARACTERISTIC
T
hs
= 25 藲C unless otherwise specified
SYMBOL
V
isol
PARAMETER
R.M.S. isolation voltage from all
three terminals to external
heatsink
CONDITIONS
f = 50-60 Hz; sinusoidal
waveform;
R.H.
鈮?/div>
65% ; clean and dustfree
MIN.
-
TYP.
MAX.
2500
UNIT
V
C
isol
Capacitance from T2 to external f = 1 MHz
heatsink
-
10
-
pF
June 1997
1
Rev 1.000
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