plastic package using 鈥檛rench鈥?/div>
technology. The combination of
very low on-state resistance and
low switching losses make this
device the optimum choice in high
speed computer motherboard d.c.
to d.c. converters.
The PHN1011 is supplied in the
SOT96-1 (SO8) surface mounting
package
PINNING
PIN
1-3
4
5-8
DESCRIPTION
SOT96-1 (SO8)
8
7
6
5
source
gate
drain
pin 1 index
1
2
3
4
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL
V
DSS
V
DGR
V
GS
V
GSM
I
D
I
DM
P
tot
T
j
, T
stg
PARAMETER
Drain-source voltage
Drain-gate voltage
Gate-source voltage (DC)
Gate-source voltage (pulse peak
value)
Drain current (t
p
鈮?/div>
10 s)
Drain current (pulse peak value)
Total power dissipation
Operating junction and storage
temperature
CONDITIONS
T
j
= 25 藲C to 150藲C
T
j
= 25 藲C to 150藲C;
R
GS
= 20 k鈩?/div>
-
T
a
= 25 藲C
T
a
= 70 藲C
T
a
= 25 藲C
T
a
= 25 藲C
T
a
= 70 藲C
-
MIN.
-
-
-
-
-
-
-
-
-
- 55
MAX.
25
25
鹵
15
鹵
20
11
9
44
2.5
1.6
150
UNIT
V
V
V
V
A
A
A
W
W
藲C
THERMAL RESISTANCES
SYMBOL PARAMETER
R
th j-a
R
th j-a
Thermal resistance junction
to ambient
Thermal resistance junction
to ambient
CONDITIONS
Surface mounted, FR4 board, t
鈮?/div>
10 sec
Surface mounted, FR4 board
TYP.
-
150
MAX.
50
-
UNIT
K/W
K/W
June 1999
1
Rev 1.100
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