Philips Semiconductors
Product specification
PowerMOS transistor
Logic level FET
GENERAL DESCRIPTION
N-channel enhancement mode logic
level field-effect power transistor in a
plastic envelope suitable for surface
mounting featuring high avalanche
energy capability, stable blocking
voltage, fast switching and high
thermal cycling performance with low
thermal resistance. Intended for use
in Switched Mode Power Supplies
(SMPS), motor control circuits and
general
purpose
switching
applications.
PHD3055L
QUICK REFERENCE DATA
SYMBOL
V
DS
I
D
P
tot
R
DS(ON)
PARAMETER
Drain-source voltage
Drain current (DC)
Total power dissipation
Drain-source on-state resistance
MAX.
60
12
50
0.18
UNIT
V
A
W
鈩?/div>
PINNING - SOT428
PIN
1
2
3
tab
gate
drain
source
DESCRIPTION
PIN CONFIGURATION
tab
SYMBOL
d
g
2
drain
1
3
s
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER
I
D
I
DM
P
D
鈭哖
D
/鈭員
mb
V
GS
V
GSM
E
AS
I
AS
T
j
, T
stg
Continuous drain current
Pulsed drain current
Total dissipation
Linear derating factor
Gate-source voltage
Non-repetitive gate-source
voltage
Single pulse avalanche
energy
Peak avalanche current
Operating junction and
storage temperature range
CONDITIONS
T
mb
= 25 藲C; V
GS
= 10 V
T
mb
= 100 藲C; V
GS
= 10 V
T
mb
= 25 藲C
T
mb
= 25 藲C
T
mb
> 25 藲C
t
p
鈮?/div>
50
碌s
V
DD
鈮?/div>
50 V; starting T
j
= 25藲C; R
GS
= 50
鈩?
V
GS
= 5 V
V
DD
鈮?/div>
50 V; starting T
j
= 25藲C; R
GS
= 50
鈩?
V
GS
= 5 V
MIN.
-
-
-
-
-
-
-
-
-
- 55
MAX.
12
9
48
50
0.33
鹵
15
鹵
20
25
6
175
UNIT
A
A
A
W
W/K
V
V
mJ
A
藲C
THERMAL RESISTANCES
SYMBOL
R
th j-mb
R
th j-a
PARAMETER
Thermal resistance junction to
mounting base
Thermal resistance junction to
ambient
CONDITIONS
TYP.
-
pcb mounted, minimum
footprint
50
MAX.
3
-
UNIT
K/W
K/W
September 1997
1
Rev 1.000
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