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Thermal Data
POWER DIP 24
20+2+2 leads
24 leads
PACKAGE MATERIAL LIST
item #
material
thickness
thermal
conductivity
2.6 W/cm擄C
0.01 W/cm擄C
leadframe
die attach
copper
epoxy glue
(silver filled)
0.25 mm
15-50 碌m
molding
compound
epoxy resin
3 mm
0.0063W/cm擄C
Charts enclosed :
1)
Rth(j-a) vs on board heat sink
2)
Zth(j-a) vs time width
November 2000
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