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PC755CMGHU366LE Datasheet

  • PC755CMGHU366LE

  • PowerPC 755/745 RISC Microprocessor

  • 50頁

  • ATMEL   ATMEL

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Features
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18.1SPECint95, Estimates 12.3 SPECfp95 at 400 MHz (PC755)
15.7SPECint95, 9SPECfp95 at 350 MHz (PC745)
733 MIPS at 400 MHz (PC755) at 641 MIPS at 350 MHz (PC745)
Selectable Bus Clock (12 CPU Bus Dividers up to 10x)
P
D
Typical 6.4W at 400 MHz, Full Operating Conditions
Nap, Doze and Sleep Modes for Power Savings
Superscalar (3 Instructions per Clock Cycle) Two Instruction + Branch
4 Beta Byte Virtual Memory, 4-GByte of Physical Memory
64-bit Data and 32-bit Address Bus Interface
32-KB Instruction and Data Cache
Six Independent Execution Units
Write-back and Write-through Operations
f
INT
max = 400 MHz (TBC)
f
BUS
max = 100 MHz
Voltage I/O 2.5V/3.3V; Voltage Int 2.0V
PowerPC
755/745 RISC
Microprocessor
PC755/745
Preliminary
尾-site
Description
The PC755 and PC745 PowerPC
廬
microprocessors are high-performance, low-
power, 32-bit implementations of the PowerPC Reduced Instruction Set Computer
(RISC) architecture, especially enhanced for embedded applications.
The PC755 and PC745 microprocessors differ only in that the PC755 features an
enhanced, dedicated L2 cache interface with on-chip L2 tags. The PC755 is a drop-in
replacement for the award winning PowerPC 750
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microprocessor and is footprint
and user software code compatible with the MPC7400 microprocessor with AltiVec
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technology. The PC745 is a drop-in replacement for the PowerPC 740
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microproces-
sor and is also footprint and user software code compatible with the PowerPC 603e
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microprocessor. PC755/745 microprocessors provide on-chip debug support and are
fully JTAG-compliant.
The PC745 microprocessor is pin compatible with the TSPC603e family.
ZF suffix
PBGA255
Flip-Chip Plastic Ball Grid Array
ZF suffix
PBGA360
Flip-Chip Plastic Ball Grid Array
G suffix
CBGA360
Ceramic Ball Grid Array
GS suffix
CI-CGA360
Ceramic Ball Grid Array with
Solder Column Interposer (SCI)
GH suffix
HITCE 360
Ceramic Ball Grid Array
Rev. 2138D鈥揌IREL鈥?6/03
1

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