PC450T11
PC450T11
s
Features
1. Built-in breakdown diode for absorption of
surge voltage
2. High current transfer ratio
( CTR: MIN. 1 500% at I
F
= 5mA )
3. Mini-flat package
4. Applicable to soldering reflow
5. Available tape-packaged products
Photocoupler with Built-in
Breakdown Diode for Surge
Voltage Absorption
s
Outline Dimensions
( Unit : mm )
Internal connection
diagram
4
3
Model No.
4.4
鹵
0.2
4
3
Anode mark
2.54
鹵
0.25
0.4
鹵
0.1
1
2
s
Applications
1. Programmable controllers
0.1
鹵
0.1
2.6
鹵
0.2
1
2
0.2
鹵
0.05
7.0
+
0.2
-
0.7
3 Emitter
4 Collector
3.6
鹵
0.3
C0.4
(Input side )
5.3
鹵
0.3
s
Package Specifications
Model No.
PC450T11
Package Specification
Taping diameter 178mm ( 750pcs. )
0.5
+
0.4
-
0.2
6藲
1 Anode
2 Cathode
s
Absolute Maximum Ratings
Parameter
Forward current
*1
Peak forward current
Reverse voltage
Power dissipation
Emitter-collector voltage
*2
Surge endurance
Collector current
Collector power dissipation
Total power dissipation
*3
Isolation voltage
Operating temperature
Storage temperature
*4
Soldering temperature
Symbol
I
F
I
FM
V
R
P
V
ECO
E
sj
I
C
P
C
P
tot
V
iso
T
opr
T
stg
T
sol
Rating
50
1
6
70
6
20
150
150
170
3.75
- 30 to + 100
- 40 to + 125
260
( Ta = 25藲C )
Unit
mA
A
V
mW
V
mJ
mA
mW
mW
kV
rms
藲C
藲C
藲C
Input
Output
*1 Pulse width <=100
碌s,
Duty ratio : 0.001
*2 Esj = 40V ( V
CEO
) x 100mA ( I
C
) x 10ms x 1/2
*3 AC for 1 min., 40 to 60% RH, f = 60Hz
*4 For 10 seconds
鈥?/div>
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.
鈥?/div>
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