1. Hybrid substrates that require high density mounting
2. Programmable controllers
鈻?/div>
Features
1. 4-pin Mini-flat package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
3. High collector-emitter voltage (V
CEO
: 80V
(鈭?
)
4. Current transfer ratio (CTR) : MIN. 50% at I
F
=5mA,
V
CE
=5V
5. Several CTR ranks available
6. High isolation voltage between input and output
(V
iso(rms)
: 3.75kV)
(*) Up to Date code "P9" (September 2002) V
CEO
: 35V.
From the production Date code "J5" (May 1997) to "P9"
(September 2002), however the products were screened by
BV
CEO
鈮?0V.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D2-A00101EN
Date Sep. 30. 2003
漏 SHARP Corporation