1.
2.
.3 .
4.
(CTR : MIN. 50% at I,=5mA, 鈥溾€?鈥榶鈥?/div>
Isolation voltage between input and output
PC357NT鈥?鈥?鈥渧i,,, :3
750v,m.
Employs double transfer mold technology
r-
Internal connection
diagram
1.
Hybrid substrates that require high density
mounting
2.
Programmable controllers
H Absduta Maximum Ratings
Parameter
(Ta= 25擄C )
Symbol
IF
IFM
VR
Rating
Forward current
*1 Peak forward current
Input
Reverse voltage
Power dissipation
Collector -emitter voltage
Emitter -collector voltage
output
Collector
current
Collector power dissipation
Total power dissipation
z
* Isolation voltage
Operating temperature
Storage temperature
*J Soldering temperature
50
1
Unit
mA
A
Soldering area
6
v
mW
,$
E
P
VCEO
70
35
6
5
VECO
lC
PC
P,.,
Vi.<
T
鈥減,
T,,~
Ts.i
v
v
mA
mW
mW
Vms
.,
h
~
50
150
170
3 750
鈥?0
to
+100
鈥?0 to +125
260
鈥榗
鈥榗
鈥榗
*I
Pulse
w,idth S 100 ps, Dlty ratio =().0()1
*2 40 to 60 擄ARlI, A C f o r I m i n u t e
*3 For 1() senconds
鈥淚n h abwnce of confirmation by dwice wifimlim $=b, WAW bkw no msibilti h any *M tit cccur In
quIwflt usng
any 01 WARPS detices, Am in calakgs,
tits Mk$ ,k Cmntact
WARP
I n order h
ohtatn the la~st
mIcm
o f me devlw =fiMWn Wi3 M usma m WAWS kvce.鈥?/div>
1317
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