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Void Free, Transfer-Molded, Thermosetting Plastic Case
Corrosion Resistant Finish, Easily Solderable
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
100% Lead Free, MSL1 @ 260擄C Reflow Temperature
xx D
xx
D
= Device Marking
= One Digit Date Code
1
2
3
5
4
ORDERING INFORMATION
Device
NZQA5V6XV5T1
NZQA6V2XV5T1
NZQA6V8XV5T1
Package
SOT-553
SOT-553
SOT-553
Shipping
4000/Tape & Reel
4000/Tape & Reel
4000/Tape & Reel
漏
Semiconductor Components Industries, LLC, 2003
1
February, 2003 - Rev. 0
Publication Order Number:
NZQA5V6XV5T1/D