鈥?/div>
Hand Held Portable Applications
USB Interface
Notebooks, Desktops, Servers
SIM Card Protection
MARKING
DIAGRAM
6
1
SOT鈭?63
CASE 463A
STYLE 6
MT MG
G
1
MAXIMUM RATINGS
(T
J
= 25擄C, unless otherwise specified)
Symbol
P
PK
1
Rating
Peak Power Dissipation
V
CC
Diode
8x20
msec
double exponential waveform,
(Note 1)
D
1
, D
2
, and D
3
Operating Junction Temperature Range
Storage Temperature Range
Lead Solder Temperature 鈥?Maximum
(10 seconds)
IEC 61000鈭?鈭? Air
IEC 61000鈭?鈭? Contact
Value
200
20
鈭?0 to 125
鈭?5 to 150
260
15000
8000
Unit
W
W
擄C
擄C
擄C
V
MT = Specific Device Code
M = Date Code
G
= Pb鈭扚ree Package
(Note: Microdot may be in either location)
T
J
T
STG
T
L
ESD
ORDERING INFORMATION
Device
Package
Shipping
鈥?/div>
NUP4060AXV6T1G SOT鈭?63 4000/Tape & Reel
(Pb鈭扚ree)
鈥燜or information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Nonrepetitive current pulse per Figure 1.
漏
Semiconductor Components Industries, LLC, 2007
1
January, 2007 鈭?Rev. 1
Publication Order Number:
NUP4060/D
1
2
3
4
