Thermal Resistance 鈥?/div>
Junction鈥搕o鈥揂mbient (Note 2.)
Total Power Dissipation @ TA = 25擄C
Continuous Drain Current @ TA = 25擄C
Continuous Drain Current @ TA = 70擄C
Pulsed Drain Current (Note 3.)
Operating and Storage
Temperature Range
Single Pulse Drain鈥搕o鈥揝ource Avalanche
Energy 鈥?Starting TJ = 25擄C
(VDD = 鈥?0 Vdc, VGS = 鈥?.5 Vdc,
Peak IL = 鈥?.0 Apk, L = 28 mH,
RG = 25
鈩?
Maximum Lead Temperature for Soldering
Purposes for 10 seconds
Symbol
VDSS
VGS
R
胃JA
PD
ID
ID
IDM
R
胃JA
PD
ID
ID
IDM
TJ, Tstg
EAS
Value
鈥?0
鹵8.0
160
0.78
鈥?.4
鈥?.92
鈥?0
88
1.42
鈥?.25
鈥?.6
鈥?0
鈥?5 to
+150
350
Unit
V
V
擄C/W
W
A
A
A
擄C/W
W
A
A
A
擄C
mJ
8
鈥?.4 AMPERES
鈥?0 VOLTS
RDS(on) = 90 mW
Single P鈥揅hannel
D
G
S
MARKING
DIAGRAM
1
Micro8
CASE 846A
STYLE 1
YWW
AD
Y
WW
AD
TL
260
擄C
Source
Source
Source
Gate
= Year
= Work Week
= Device Code
PIN ASSIGNMENT
1
2
3
4
8
7
6
5
Drain
Drain
Drain
Drain
1. Minimum FR鈥? or G鈥?0 PCB, Steady State.
2. Mounted onto a 2鈥?square FR鈥? Board (1鈥?sq. 2 oz Cu 0.06鈥?thick single
sided), Steady State.
3. Pulse Test: Pulse Width
鈮?/div>
300
ms,
Duty Cycle
鈮?/div>
2%.
Top View
ORDERING INFORMATION
Device
NTTS2P02R2
Package
Micro8
Shipping
4000/Tape & Reel
漏
Semiconductor Components Industries, LLC, 2000
1
December, 2000 鈥?Rev. 4
Publication Order Number:
NTTS2P02R2/D
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