Thermal Resistance 鈥?/div>
Junction鈥搕o鈥揂mbient (Note 2.)
Total Power Dissipation @ T
A
= 25擄C
Continuous Drain Current @ T
A
= 25擄C
Continuous Drain Current @ T
A
= 70擄C
Pulsed Drain Current (Note 3.)
Operating and Storage
Temperature Range
Single Pulse Drain鈥搕o鈥揝ource Avalanche
Energy 鈥?Starting T
J
= 25擄C
(V
DD
= 鈥?0 Vdc, V
GS
= 鈥?.5 Vdc,
Peak I
L
= 鈥?.5 Apk, L = 5.6 mH,
R
G
= 25
鈩?
Maximum Lead Temperature for Soldering
Purposes for 10 seconds
Symbol
V
DSS
V
GS
R
胃JA
P
D
I
D
I
D
I
DM
R
胃JA
P
D
I
D
I
D
I
DM
T
J
, T
stg
E
AS
Value
鈥?0
"8.0
250
0.50
鈥?.45
鈥?.15
鈥?0
125
1.0
鈥?.04
鈥?.64
鈥?6
鈥?5 to
+150
35
Unit
V
V
擄C/W
W
A
A
A
擄C/W
W
A
A
A
擄C
mJ
G
S
8
1
Micro8
CASE 846A
STYLE 2
MARKING DIAGRAM
& PIN ASSIGNMENT
Source 1
Gate 1
Source 2
Gate 2
1
8
2 YWW 7
3
6
BC
4
5
(Top View)
Drain 1
Drain 1
Drain 2
Drain 2
T
L
260
擄C
1. Minimum FR鈥? or G鈥?0 PCB, Steady State.
2. Mounted onto a 2鈥?square FR鈥? Board (1鈥?sq. 2 oz Cu 0.06鈥?thick single
sided), Steady State.
3. Pulse Test: Pulse Width = 300
ms,
Duty Cycle = 2%.
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
Y
= Year
WW = Work Week
BC = Device Code
ORDERING INFORMATION
Device
NTTD1P02R2
Package
Micro8
Shipping
4000/Tape & Reel
漏
Semiconductor Components Industries, LLC, 2000
1
November, 2000 鈥?Rev. 0
Publication Order Number:
NTTD1P02R2/D