鈮?/div>
1
ms)
Total Power Dissipation @ T
A
= 25擄C
Operating and Storage Temperature Range
Thermal Resistance 鈭?Junction鈭抰o鈭扐mbient
Maximum Lead Temperature for Soldering
Purposes, (1/8鈥?from case for 10 s)
Symbol
V
DSS
V
GS
I
D
I
DM
P
D
T
J
, T
stg
R
qJA
T
L
Value
鈭?0
鹵20
鈭?.0
鈭?.67
400
鈭?55 to
150
300
260
mW
擄C
擄C/W
擄C
P2
W
Unit
V
V
A
1
2
SOT鈭?3
CASE 318
STYLE 21
3
S
MARKING DIAGRAM/
PIN ASSIGNMENT
3
Drain
P2W
1
Gate
2
Source
= Specific Device Code
= Work Week
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
ORDERING INFORMATION
Device
NTR1P02T1
NTR1P02T3
Package
SOT鈭?3
SOT鈭?3
Shipping
鈥?/div>
3000/Tape & Reel
10,000/Tape & Reel
鈥燜or information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
漏
Semiconductor Components Industries, LLC, 2004
1
July, 2004 鈭?Rev. 3
Publication Order Number:
NTR1P02T1/D
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