鈭?/div>
55 to
150
300
260
Unit
V
V
3
I
DM
P
D
T
J
, T
stg
R
qJA
T
L
A
A
mW
擄C
擄C/W
擄C
1
2
SOT鈭?3
CASE 318
STYLE 21
G
S
MARKING DIAGRAM &
PIN ASSIGNMENT
Drain
3
P02 M
G
G
1
Gate
2
Source
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
P02
= Specific Device Code
M
= Date Code*
G
= Pb鈭扚ree Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
NTR1P02LT1
NTR1P02LT1G
NTR1P02LT3
NTR1P02LT3G
Package
SOT鈭?3
SOT鈭?3
(Pb鈭扚ree)
SOT鈭?3
SOT鈭?3
(Pb鈭扚ree)
Shipping
鈥?/div>
3000 Tape & Reel
3000 Tape & Reel
10,000 Tape & Reel
10,000 Tape & Reel
鈥燜or information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
漏
Semiconductor Components Industries, LLC, 2006
May, 2006
鈭?/div>
Rev. 8
1
Publication Order Number:
NTR1P02LT1/D
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