鈮?/div>
10
ms)
Total Power Dissipation
Operating and Storage
Temperature Range
Single Pulse Drain鈥搕o鈥揝ource Avalanche
Energy 鈥?Starting TJ = 25擄C
(VDD = 20 Vdc, VGS = 5 Vdc,
IL = 10 Apk, L = 10 mH, RG = 25
鈩?
Thermal Resistance 鈥?/div>
Junction鈥搕o鈥揂mbient (Note 1.)
Single Channel
Steady State
Both Channels
Junction鈥搕o鈥揂mbient (Note 2.)
Both Channels
Thermal Resistance 鈥?Junction鈥搕o鈥揕ead
Single Channel
Both Channels
Steady State
1. Surface Mounted to Min Pad.
2. Surface Mounted to 1鈥?x 1鈥?FR4 Board.
Symbol
VDSS
VGS
ID
ID
IDM
PD
TJ, Tstg
EAS
Value
20
"12
5.8
TBD
20
1.6
鈥?5 to
+150
580
Unit
Vdc
Vdc
Adc
8
G1
S1
G2
S2
TSSOP鈥?
CASE 948S
PLASTIC
1
W
擄C
mJ
S1
G1
S2
G2
MARKING DIAGRAM
& PIN ASSIGNMENT
1
2
3
4
DEVICE
MARKING
TBD
Top View
8
7
6
5
D
D
D
D
R
qJA
180
176
100
R
qJL
擄C/W
擄C/W
27
24
ORDERING INFORMATION
Device
NTQD6866
NTQD6866R2
Package
TSSOP鈥?
TSSOP鈥?
Shipping
100 Units/Rail
3000/Tape & Reel
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
漏
Semiconductor Components Industries, LLC, 2001
1
January, 2001 鈥?Rev. 1
Publication Order Number:
NTQD6866/D
1
2
3
4
