Thermal Resistance 鈭?/div>
Junction鈭抰o鈭扐mbient (Note 2)
Total Power Dissipation @ T
A
= 25擄C
Drain Current 鈭?Continuous @ T
A
= 25擄C
Operating and Storage Temperature Range
Single Pulse Drain鈭抰o鈭扴ource Avalanche
Energy 鈭?Starting T
J
= 25擄C
(V
DD
= 50 V
dc
, V
GS
= 10 V
dc
, I
L
= 15.5 A
pk
,
L = 1 mH, R
G
= 25
W)
Maximum Lead Temperature for Soldering
Purposes, 1/8鈥?from Case for 10 Seconds
Symbol
V
DSS
V
GS
R
qJC
P
D
I
D
I
D
I
D
I
D
R
qJA
P
D
I
D
R
qJA
P
D
I
D
T
J
, T
stg
E
AS
Value
24
鹵20
1.1
113.6
125
120.5
95
250
46
2.72
18.6
63
1.98
15.9
鈭?5 to
150
120
Unit
V
dc
V
dc
擄C/W
W
A
A
A
A
擄C/W
W
A
擄C/W
W
A
擄C
mJ
2
1 3
T
L
260
擄C
http://onsemi.com
125 AMPERES, 24 VOLTS
R
DS(on)
= 3.7 mW (Typ)
D
G
S
MARKING
DIAGRAMS
TO鈭?20AB
CASE 221A
STYLE 5
4
125N2R
YWW
1
2
3
4
D
2
PAK
CASE 418AA
STYLE 2
125N2
YWW
1. When surface mounted to an FR4 board using 1 inch pad size,
(Cu Area 1.127 in
2
).
2. When surface mounted to an FR4 board using minimum recommended pad
size, (Cu Area 0.412 in
2
).
125N2
Y
WW
= Specific Device Code
= Year
= Work Week
ORDERING INFORMATION
Device
Package
D
2
PAK
D
2
PAK
TO鈭?20AB
Shipping
鈥?/div>
50 Units/Rail
800/Tape & Reel
50 Units/Rail
PIN ASSIGNMENT
PIN
1
2
3
4
FUNCTION
Gate
Drain
Source
Drain
NTB125N02R
NTB125N02RT4
NTP125N02R
鈥燜or information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
漏
Semiconductor Components Industries, LLC, 2003
1
October, 2003 鈭?Rev. 4
Publication Order Number:
NTB125N02R/D
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