鈩?/div>
N鈥揅hannel
D
Typical Applications
G
4
S
1
Unit
Vdc
Vdc
Vdc
V
GS
V
GSM
I
D
I
D
I
DM
P
D
T
J
, T
stg
E
AS
"20
"40
10
8.0
35
201
1.61
鈥?5 to
+150
500
Adc
1
2
TO鈥?20AB
CASE 221A
STYLE 5
3
2
3
D
2
PAK
CASE 418B
STYLE 2
4
MAXIMUM RATINGS
(T
C
= 25擄C unless otherwise noted)
Rating
Drain鈥揝ource Voltage
Drain鈥揋ate Voltage (R
GS
= 1.0 M鈩?
Gate鈥揝ource Voltage
鈥?Continuous
鈥?Non鈥揜epetitive (t
p
v10
ms)
Drain 鈥?Continuous
鈥?Continuous @ 100擄C
鈥?Single Pulse (t
p
v10
碌s)
Total Power Dissipation
Derate above 25擄C
Operating and Storage
Temperature Range
Single Drain鈥搕o鈥揝ource Avalanche
Energy 鈥?Starting T
J
= 25擄C
(V
DD
= 100 V, V
GS
= 10 Vdc,
I
L
= 10 A, L = 10 mH, R
G
= 25
鈩?
Thermal Resistance
鈥?Junction鈥搕o鈥揅ase
鈥?Junction鈥搕o鈥揂mbient
鈥?Junction鈥搕o鈥揂mbient (Note 1.)
Maximum Lead Temperature for
Soldering Purposes, 1/8鈥?from case
for 10 seconds
Symbol
V
DSS
V
DGR
Value
600
600
MARKING DIAGRAMS
AND PIN ASSIGNMENTS
Drain
Drain
Watts
W/擄C
擄C
mJ
NTP10N60
LLYWW
Gate
Source
Gate
NTB10N60
LLYWW
Drain
Source
Drain
擄C/W
R
胃JC
R
胃JA
R
胃JA
T
L
0.62
62.5
50
260
擄C
NTx10N60
LL
Y
WW
= Device Code
= Location Code
= Year
= Work Week
ORDERING INFORMATION
Device
NTP10N60
NTB10N60
NTB10N60T4
Package
TO鈥?20AB
D
2
PAK
D
2
PAK
Shipping
50 Units/Rail
50 Units/Rail
800/Tape & Reel
1. When surface mounted to an FR4 board using the minimum recommended
pad size.
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
Preferred
devices are recommended choices for future use
and best overall value.
漏
Semiconductor Components Industries, LLC, 2000
1
November, 2000 鈥?Rev. 1
Publication Order Number:
NTP10N60/D